Shash: First, the die being used for all this "testing" are produced on small wafers, in the 2 and 4 inch range, that can be made and rejected quickly and maniplulated by the engineers in the extapial stage (building them).

There is  no need for  wafer size conversion as the Optical Interposer is already being tested at 8” and  we know  this since the physical evidence was brought to  the AGM last year.

https://agoracom.com/ir/POETTechnologies/photos

The InP active die may well be using 2 inch wafers for R&D of  future discrete components at DL and  other locations but it is OI where we begin  to talk about  wafer scale production through the use of pick and place tools at high throughput.

Clearly this  will  require clarification by Suresh and/or Vivek.