Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Patent Publication

 

United States of America

Application Number

16876059

 

Application Date

17.05.2020

 

Publication Number

20200278495

 

Publication Date

03.09.2020

 

Publication Kind

A1

IPC

G02B 6/12 G02B 6/13 G02B 6/42 G02B 6/43

CPC

G02B 6/12019 G02B 6/12028 G02B 6/13 G02B 6/421 G02B 6/1223 G02B 6/4272

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Applicants

POET Technologies, Inc.

 

Inventors

Suresh Venkatesan

Yee Loy Lam

 

US20200278495 - OPTICAL DIELECTRIC WAVEGUIDE SUBASSEMBLY STRUCTURES

 

Title

(EN) OPTICAL DIELECTRIC WAVEGUIDE SUBASSEMBLY STRUCTURES

 

Abstract

(EN)

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

 


https://patentscope.wipo.int/search/en/detail.jsf?docId=US305253871&tab=NATIONALBIBLIO&_cid=P20-KERB17-54720-1

 

 

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