Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Wow they reviewed and approved this during Covid... 

United States of America

Application Number

16876059

 

Application Date

17.05.2020

 

Publication Number

20200278495

 

Publication Date

03.09.2020

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