That page 10 is very interesting. It references. Through Silicon Vias(TSV) for Dense interconnects on interposer for 2.5D high speed routing
In March this year AMD announced a new X3d Chip to be launched in the future....No specific details.
“The new technology is a combination of 2.5D packaging, which involves placing multiple chips on a single interposer and tying them together with through-silicon vias (TSV), and 3D stacking, which uses multiple dies stacked atop one another that are then mounted to an interposer (as seen below) with TSV connections extending throughout AMD hasn't provided details of which elements, be they memory or compute die (logic), it will incorporate into the X3D stacking designs, instead telling us that it will unveil the more technical aspects of its new packaging technique at a more tech-centric event in the future”
