Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
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Baba, roughly, each die (optical interposer) is sized somewhere beteen the head of a pin and the head of a wooden match (approx 3/32 of an inch square). So, that's a lot of die per wafer!