Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: It's their move.

North American Tier 1:

We completed proof of concept.  (I'm assuming that this turned into a pilot project using scientific principles specifically conducted to satisfy all of their questions.)

We are still engaged with them......

Are we in a design phase for something specific?

What we offer:

Price advantages.

Performance advantages.

Ease of production with our planar architecture.

Mass production through Sanan IC in Xiamen.

Unless they have decided to team-up with someone else, then we should anticipate eventual contract news.  It is only this what are they waiting for period that bothers me a bit, but given the complexity of these devices, there could be many reasons for the perceived delay.

 

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