Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Intel’s presentation at OIF Webinar - "Co-Packaged Optics - Why, What and How”
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Fairchij: The market has not seen it yet but they will. The push is clearly on to get the word out.

Yes. And if all else fails, this will happen when the numbers are in the financial reports and the robots chew through them.

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