OIDA Co-Packaging Technologies Workshop

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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oz4m2

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OIDA Co-Packaging Technologies Workshop

posted on Mar 24, 2021 12:59PM

Join Industry Leaders for a Virtual Workshop

Tuesday, 30 March & Wednesday, 31 March
https://www.osa.org/en-us/meetings/industry_events/2021_oida_workshop/

Join Colleagues from these Innovative Companies:
   •   Broadcom
   •   Cadence
   •   Cisco
   •   Elenion Technologies
   •   Global Foundries
   •   Google
   •   IBM
   •   Infinera
   •   Intel
   •   INVIDIA
   •   Luxtera
   •   Microsoft
   •   NVIDIA
   •   Optoscribe
   •   Precision Optical Transceivers
   •   SCINTIL Photonics
   •   Tencent

Whatever you are up to be ready.
Cheers

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