Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

Free
Message: OFC Workshops - Industry Leaders Unaware of POET?

Hoping someone can shed some light on why it appears that the Workshops are essentailly discussing POET Technology but industry leaders either not aware or discounting it.

May be missing something but would have expected POET to be on the panels if they have the technology ready to go to market.

 

Workshop: Are We on the Right Track to Bring Co-packaged Optics to Its Prime Time?

  •  widely anticipated that next-gen 51.2 Tb/s switch ASIC will need co-packaged optics (CPO) to tackle the looming challenges in power consumption and bandwidth density.
  • CPO is also promising to flatten current multi-layer switching architecture through a high-radix switch, and enable a large-volume application of fiber to the server (FTTS). T
  • workshop is to stimulate extensive discussions on necessity and challenges to partially/completely replace pluggable solution, and to explore current CPO technology readiness and its future development direction in datacenters and beyond.
  • The workshop will be debating and answering the following three areas:
  1. Is CPO a nice-to-have or must-have solution within 3 years? Data center operators and system vendors will discuss their most concerned issues, and the potential applications (e.g., FTTS) CPO can enable or enhance?
  2. What are the most recent technology breakthroughs in chip-level building blocks, e.g., SEDES, lasers, VCSEL vs. SiPh, parallel/WDM, DD/coherent, and PICs?
  3. What are the progresses in system integration, including packaging, thermal management, optical connectivity, system-level testing and diagnosis, redundancy and serviceability, scalability, signal and power distribution co-design of optical integration with switch/DSP/logic ASIC, and relevant standard development?

 

Workshop: Which Device Technologies Will Get Us Beyond 400G?

  • workshop will discuss different optical device technologies that can be the potential candidates for 200Gbps/lane in parallel and WDM short reach 800G IMDD systems and single carrier 600-800G coherent system
  • look into the pros and cons of co-packaged optics using different architectures and optical technologies in comparison with pluggable optics
  • debate co-packaged optics deployment timelines and volume as well as potential platform interoperability challenges.
  •  discuss and compare the achievable performance by different device technologies and technical challenges ahead as the potential solutions for both post 400G IMDD and coherent systems in terms of cost/form factor/power consumption/thermal stability/interoperability relative to current 400G products.
Share
New Message
Please login to post a reply