Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Product timing for 100/200g and 400g per the Shelf Prospectus

Nice summary. Begs the question, what will the upcoming $300M US funds raised over 25mo be used for? Wild guess, they are going to invest more bills in fabrication facility buildout/equipment purchases.

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