Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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At OFC 2022

 

Wednesday, 09 March 12:30 – 13:00
Theater III

POET will demonstrate Optical Interposer Platform for 100/200G CWDM/LR4, scaling to 400G FR4 and 1.6T/3.2/6.4T co-packaged optics. A unique hybrid integration platform extends Silicon Photonics to enable wafer-scale manufacturing of fully integrated electronics and photonics using passive flip-chip bonding, resulting in a single chip optical engine, featuring the world’s smallest DML-based TxRx engine.

Truly speed agnostic.

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Feb 08, 2022 10:28AM
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