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Why Integration Matters:
Packaging and testing are a large fraction of BOM cost of conventional Photonics devices. Integration of devices is the only effective means to
- Improve size, power, cost, speed, reliability and scalability
- Enable new functionalities
- Drive disruption in optical communications
DenseLight’s new generation of InP optoelectronics is designed for flip-chip wafer level hybrid integration on Silicon Photonics and Optical Interposer Platforms.