Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Denselight

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Why Integration Matters:

Packaging and testing are a large fraction of BOM cost of conventional Photonics devices. Integration of devices is the only effective means to

  • Improve size, power, cost, speed, reliability and scalability
  • Enable new functionalities
  • Drive disruption in optical communications

 

DenseLight’s new generation of InP optoelectronics is designed for flip-chip wafer level hybrid integration on Silicon Photonics and Optical Interposer Platforms.

 

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