ICC News September 9, CIOE 6 officially opened, photonic integration, high-speed optical module and optical interconnection integrated solution provider Suzhou Zhuoyu Photonics Technology Co., Ltd. grandly unveiled a series of solutions for DCN/DCI optical connectivity and 2023G/F5G applications in data centers, showcasing 5G and 400G series products, as well as DCI for DCI applications BOX equipment, highly concerned by industry customers, booth number 800A11.
Dr. Zhu Yu, executive deputy general manager of Suzhou Zhuoyu Photonics Technology Co., Ltd., was interviewed by Xunshi Guang Communication Network, and he said that Zhuoyu saidPhotonics has successfully launched a series of optical communication products for data center DCN and DCI applications. In terms of data center DCN, the company's products on display include 400G QSFP-DD SR4/DR4/FR4/LR4、800G QSFP-DD DR8/2×FR4、800G OSFP SR8/2×FR4, the product covers the connection distance from 30 meters to 10 kilometers, the package form includes QSFP-DD and OSFP, which can fully meet the needs of domestic and foreign data centers.
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The company successfully released the first domestic 2021.3T based on silicon photonics technology in 2 The CPO prototype, which adopts the co-packaging concept of the core switch chip and the optical engine on the same high-speed motherboard, greatly shortens the distance from the photoelectric conversion function to the core switch chip, and the prototype was unveiled again at this year's CIOE exhibition. In the past two years, the company has been upgrading the performance of silicon photonics, high-density system, high-speed co-packaging and thermal management, and is currently defining a new generation of CPO products with customers.
At the same time, Zhuoyu Photonics is also expanding from optical module business to equipment subsystem. In terms of data center DCI, Zhu Yu introduced that Zhuoyu Photonics launched 1U/2U DCI BOX, single fiber can transmit 25.6T, the customer side can be compatible with various protocol signals, can flexibly configure OTA, TFF, MUX/DEMUX, WSS, OCM, OTDR, OLP and other optical layer boards, to achieve flexible networking and deployment of equipment, to create an open optical network architecture.
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In addition, in terms of F5G, the company has also launched industrial-grade XGS PON&GPON Combo OLT SFP+/SFP-DD Class D AND XGS PON OLT SFP+ E2 and other ultra-large link power budget optical modules can solve long-distance broadband access requirements.
In terms of core competitiveness, Zhu Yu introduced that since its establishment in 2018, the company has focused on the research and development and innovation of silicon photonics technology to achieve high-speed solutions. The company has successfully built a silicon photonics industrialization platform, including silicon photonics passive and active chip device libraries, high-speed module design, CPO-related packaging technology and a leading silicon photonics packaging production line in China, which can cover 400G The DR4 and the 800G DR8 under development feature high-precision placement and high automation.
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The company has achieved relevant results for the next generation of optical module technology. In order to further promote the industrialization of silicon photonics technology, Zhuoyu Photonics is developing 800G DR8 module products, the company is also optimistic about the hybrid integration of thin film lithium niobate and silicon photonics and focus on the development of single-wave 200G optical modules, single-wave 200G optical modules will be a new type of silicon photonics and thin film lithium niobate hybrid integration, needed High-precision packaging technologies such as 2.5D packaging can achieve 800G and 1.6T rates.
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Dr. Zhu Yu (middle) is interviewed by Xunshi
Zhuoyu Photonics is positioned in the design and production of high-end optical modules, based on silicon photonics, indium phosphide and thin-film lithium niobate technologies, from chip design, packaging, testing, to high-speed optical transceiver modules and transmission subsystem design, packaging, testing, manufacturing vertical integration. Photonic integration technology reduces the number of discrete components, reduces power consumption, simplifies product commissioning, green and low-carbon manufacturing, improves production efficiency and yield, and helps customers reduce costs.
