The co-design and packaging of photonics and PICs on different materials is not the only issue: co-design with electronics is also key and plays an important role.

We as PIC industry need targets and metrics of the tolerance for coupling losses between silicon and III-V, otherwise the industry will aim for the best possible figures whereas we need to focus more on the ease of reliable and cost-effective manufacturability.

There is a need for a joint roadmap that defines where hybrid integration should be in 5 years. To be useful we need a broad scope of participants going beyond photonics companies. To a large extent, this should be a semiconductor-photonics roadmap that involves the whole value chain from components suppliers, foundries, system manufacturers and service providers.

POET is well-positioned.