Looks like POET! They talk about an uncooled solution with integrated heat sinks. POET also has this: "Integrated heat sinks are incorporated under the metal and in regions of the interposer that house the lasers, enabling a low thermal resistance for the lasers, which is critical to ensure laser functionality in uncooled applications." (Source). They talk about 8 lasers and also POET's solution can go up to 8 for the C-band and even 12 if I remember correctly for the O-band. They say it is wafer scale processed and tested. POET does that.

But, the slide at 01:21 says "Remote laser (*Broadcom solution*)". And, under "challenges" they say that 1. a larger PIC area is required, 2. lower power and 3. higher power consumption due to a higher thermal load. POET's solution overcomes these challenges no?

If it's not POET than it is quite sure that POET is going the right way and there will be plenty of customers anyway.