Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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The Holk

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Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

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24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

foxy74

posted on Sep 20, 2022 08:03AM

Did anybody recognise the following article from HG Genuine?

Look at the pictures, read the text. Here we have a POET customer, no?

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