8:39, SV: A little more than 18 months back, we first introduced our Optical Interposer-based solutions to the world with 100G/s CWDM. Those products are now in the commercialization phase. In 18 months we have leapfrogged from 100G/s and are now demonstrating solutions at 1.6Tb/s. It’s unprecedented for a team our size; we are at the cutting-edge of what data communication speeds and bandwidth are asking for. It points to the simplicity of what it is that we have developed with our Optical Interposer: that is our fundamental innovation. We’re still the only company espousing and demonstrating a wafer-level, chip-scale, packaging solution for photonics. We do that with a proprietary waveguide architecture that sandwiches optical waveguides in between electrical waveguides creating a unique architecture that addresses all the various parameters that matter. People actually don’t talk about, but we are public about, having solved issues associated with mechanical, optical, and thermal challenges associated with such solutions. That’s what makes our interposers ubiquitous in terms of being able to meet the requirements of multiple markets, starting from DML lasers where we’re the only [“only one?”, audio drops then skips ahead ~10:11—not sure how much is omitted] …with a chip on board configuration… two other applications and market verticals.