Listen to Lebby,

at 39 minutes, he refers to size and footprint is "absolutely critical" also says cost, performance and getting the power down is a big play, the refers chip scale and to flip chip the pic to an interposer or sub mount or platform is going to be the most efficient way to get your OE inside a transceiver whether onboard or edge of a card, we need to scale it in volume, global foundries said photonics chip scale packaging is going to be critical to scale up.

Then at 40 minutes when asked about a standard for interposers Lebby's response is...."we've seen flip chip lasers onto platforms and interposers has been recently successful .....looking to chip scale pic chips that include laser sources and I think that's an important factor and I think the industry has to take quite seriously.

Thank you  Mr Lebby, what more can we ask for? Poet Technologies is the only company in the world that can flip chip DML lasers onto a pic and do it at chip scale. Next time don't forget to mention the name Mr Lebby,

PO ET Technooooolooooogeeeeese, thanks again.

Suresh's verbiage is now matriculating itself  (since it's football time of year) through the entire industry.

SP