Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Patent application published Jan 19th 2023, filed Sept 2022.  A continuation of patents filed in 2017 and 2020, further strengthening patent protection of their their unique and disruptive process.

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20230021029

 

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