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Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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fairchijisback

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Re: Follow tweet

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Babaoriley

posted on May 26, 2023 01:47PM

Umm...the actual process to flip chip devices is done in an automated line at wafer scale in a two step bonding process. First the rapid placement by pick and place tools with an initial bond then the entire wafer goes through solder reflow to permanently fix all elements in place.