Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Interesting: "O" is for optical

So, HBM is a new type of memory chip with low power consumption and ultra-wide
communication lanes. It uses vertically stacked memory chips interconnected by microscopic
wires called "through-silicon vias," or TSVs.  So how would something like this become Optical HBM?  Can the vertically stacked memory chips be interconnected by fiber instead of microscopic wires?  Do the microscopic wires become a microscopic bottleneck like all the other areas involving copper?  Does the signal convert to optical beyond the memory chips, or does it go in optical and come out optical?  Would O-HBM now make this type of memory compatible with on-chip integration and a mini "holy grail" has been developed?  It's this last thought that I'm leaning towards at the moment.

Celestial AI and AMD might be working some magic together.

Really looking forward to Celestial AI coming out of stealth mode.

 

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