Patent Application

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Mironclaw

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Patent Application

posted on Jul 20, 2023 11:09AM

I don't usually post patent applications, but this one is interesting. For those who want to see illustrations of how Poet's interposer PIC (photonic integrated circuit) structures and assemblies are formed.

A lot of details (starting page 9)

Date of patent application : November 21, 2022 (published july 20, 2023)

Patent application number : US-20230228953-A1

Inventors : Suresh Venkatesan, San Jose, CA (US); Jing Yang, Singapore (SG); Lucas Soldano, San Jose, CA (US)

Self-Aligned Fanout Waveguide Structure on Interposer with Linear Multicore Optical Fiber

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20230228953

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