Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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"For the other guys currently producing 400G TX OEs and wanting to step up to making 800G TX, they will have to build something brand new." 

Doesn't the existing size of the QSFP-DD package become a major problem for competitive implementations going forward?  Ditto for users who don't want to expand their existing hardware real estate.  Seems like a major competitive advantage in both cases.

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