Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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"My original statement, above, was for Packaged Light Source only. OEs for optical modules is another story and have no comment on why there were delays with FiberTop. The MDA should provide some information. "


B&C,

With your knowledge of the light source applications should we expect a similar timeline for customer testing after the products are released to production like we are currently experiencing with the OEs and soon the modules?  Any chance that process will be faster?

Thanks 

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