Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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While we wait for the financing to close.

This patent relates to electrical wafer testing.

Date of patent application : March 27th, 2023 (published november 30th, 2023)

Patent application number : US-20230384516-A1

Inventors : Suresh Venkatesan, San Jose, CA (US); Jing Yang, Singapore (SG)

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20230384516

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