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Design of Next Gen Light Centric Computers ..... Mark Stansberry ... The StatisticsMatrix .... December 15th, 2023
Today's engineers and scientists are thinking of light and light waveguides instead of electronic current and transistors as the basis for next generation AI centric cell phones, laptops and networks, Sometimes referred to as photonic phones, photonic computers and photonic networks, or simply light devices.
Find below a conceptual prerelease sketch and operational description of an optoelectronjc interface for a photonic computer (for possible inclusion into the Dawn of the Nanophotonics Age Company Profile Series). This conceptual design, based on POET Technologies' optoelectronic interposer, makes use of the monolithically embedded optical mirrors on the top waveguide layer of POET's interposer. The optical arrangement allows the light waves to be directed vertically upwards to the top mounted photodiodes.
The multi-colored light bus, at the bottom of the diagram, transports data encoded light. The data encoded light which rides on three carriers (red, blue and green) feeds the three light receivers: a red light receiver, a blue light receiver and a green light receiver. The optics of the waveguide and the associated angling of the planes along with an optical directional beam device allows for a 90 degree orthogonal bend of the red modulated Lightwave carrier (to minimize any light power losses). The red light goes through an aperture which the red photodetector senses and converts into an analog electrical waveform. The transimpedance amplifier is used to amplify the low level electrical signal that the red photodetector produces. In this case, the light input comes from a light fidelity network, (LiFi) which is part of a hybrid WiFi / LiFi PAM4 communications network.
It should be noted that POET's interposer is often referred to as an optical interposer. However, if you examine POET's interposer drawings, metal traces are in the interposer's lower layers. These metal trace layers and associated silicon through hole vias are used to make connections with any electronic or optoelectronic dice that are flip chip bonded to the interposers top die attach layer and any electronic die that are on the lower silicon PCB that the interpose is also bonded to.
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