Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Builds on a previous patent.

 

Date of patent : February 20th, 2024

Patent number : 11906798-B2

Inventors : Yee Loy Lam, Singapore (SG); Suresh Venkatesan, Los Gatos CA (US); Long Cheng Koh, Singapore (SG)

Title : Method of forming an hermetic seal on electronic and optoelectronic packages

https://ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11906798

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