Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Here’s another Gold Nugget
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Thx B&C,

I forgot to mention the most important part of Raju's comment. The path to 3.2T using the same form factor was the "Deal Clincher!" (see, my medication is kicking in, no caps this time!) lol

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