Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: March 05, 2018 (Do we want to know what did, or did not happen here?)

And here a bit more information of Surinno Photonics; maybe of interest:

"Suzhou Surinno Photonics Technology Co., Ltd., established in March 2018 with a registered capital of USD 34 million, is a high-tech enterprise focusing on photonics integration solutions, high-speed optical modules and optical interconnection overall solutions. Surinno Photonics is committed to researching, developing and industrializing photonics integration solutions, reducing the complexity and manufacturing difficulty of optical components and modules, and striving for vertical integration of the whole industry chain from design, packaging and test of the photonics integration solutions to design, packaging, manufacturing and test of optical modules.

The company’s management team is experienced in product R&D, technical market, production operation and other business management matters, and specializes in developing all series of optical transceiver modules such as10G, 25G, 40G, 100G, 200G, 400G, 800G and CPO. The series and solutions mainly cover 5G Front-Haul, data center, communication transmission, and access networking, etc. The company has a platform for design and test of photonics integrated chips, a platform for high-speed signal design & simulation, a platform for COB packaging, and a platform for co-packaged optics, etc."

 

Source: http://en.surinno.com.cn/gongsijianjie/

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