Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

Free
Message: Multilane testing being used as part of Hyper Photonix demo at OFC 2024

 Ningbo Xinsulian Photonics Technology Co

This is the name of the parent Chinese company

About us (hyperphotonix.com)

About Chipspeed

Xinsulian Optoelectronics Technology Co., Ltd. is an optical communication enterprise with silicon photonics and DSP technology as the core and vertical integration capabilities of the industrial chain.

With the self-developed Hyper Silicon™ photonics technology platform as the core, Xinsulian's super manufacturing factory in Anhui has built a complete wafer in-module out automatic optical module production platform, and the factory has realized a complete set of processes and processes from optical chip design to packaging, from optical module design to mass production.

 

High-speed interconnects

Xinsulian R&D Center:

Ningbo, Wuhan, San Jose in the United States, Tokyo in Japan

 

Innovation:

  • Xinsulian Optoelectronics focuses on core technologies such as 400G and above high-speed optical interconnection technology, silicon photonics integrated chips, high-speed optical engines, high-speed optical modules and high-speed electronic modulation and demodulation chips (DSP).

  • Continuous research and development of optical interconnection above 1.6T, and breakthrough in 200G single-wave silicon photomodulation technology

  • Featuring innovative ultra-low-cost and ultra-low-power Coherent-Lite technology

 

Xinsulian high-speed silicon photonics module production base:
established a Wafer-In-Module-Out production mode based on self-developed silicon photonics integrated chips to realize the mass production and batch delivery of 400G DR4/800G DR8 series high-speed silicon photonic modules

See more

 

Share
New Message
Please login to post a reply