On June 12, local time, Samsung Electronics showcased its latest foundry innovations and outlined its vision for the era of artificial intelligence during the Samsung Foundry Forum (SFF), an annual event held at the U.S. headquarters of the device solution business in San Jose, California.

Under the theme of "Empowering the AI Revolution", Samsung announced its enhanced process technology roadmap, including two new cutting-edge nodes, SF2Z and SF4U, as well as an integrated Samsung AI solution platform that leverages the unique strengths of its foundry, memory, and advanced packaging (AVP) businesses.

Dr. Choi Si-young, President and Head of Foundry Business of Samsung Electronics, said, "In an era where many technologies are evolving around AI, the key to realizing AI lies in high-performance, low-power semiconductors. In addition to our proven GAA process optimized for AI chips, we plan to launch integrated co-packaged optics (CPO) technology to enable high-speed, low-power data processing, providing our customers with the one-stop AI solutions they need to thrive in this era of change." ”

Samsung's event also featured prominent industry thought leaders such as Arm CEO Rene Haas and Groq CEO Jonathan Ross, who took the stage to highlight the solid partnerships with Samsung in tackling new AI challenges. Approximately 30 partner companies exhibited at the booth, further highlighting the dynamic collaboration of the U.S. foundry ecosystem.

According to Samsung's forecast, its AI-related customer list will expand fivefold by 2028, and its revenue will grow ninefold.

Empower customer AI solutions with state-of-the-art process technology roadmaps

Samsung announced the launch of two new process nodes, SF2Z and SF4U, strengthening its cutting-edge process technology roadmap.

The company's latest 2nm process, SF2Z, features an optimized backside power delivery network (BSPDN) technology that places the power rails on the back of the wafer to eliminate bottlenecks between the power and signal lines. Applying BSPDN technology to SF2Z not only improves power, performance, and area (PPA) compared to the first generation of 2nm node SF2Z, but also significantly reduces voltage drop (IR drop), thereby improving the performance of HPC designs. Volume production of the SF2Z is expected to begin in 2027.

On the other hand, SF4U is a high-value 4nm variant that offers PPA improvements by incorporating optical shrinkage, with mass production planned for 2025.

Samsung reiterated that preparations for SF1.4 (1.4nm) are progressing well, with performance and yield targets on track for mass production in 2027. Emphasizing its continued commitment to going beyond Moore's Law, Samsung is actively shaping future process technologies below 1.4nm through material and structural innovations.

Continue to improve the maturity of GAA

With the advent of the era of artificial intelligence, structural improvements such as ring gates (GAAs) have become necessary to meet power and performance requirements. At SFF, Samsung highlighted the maturity of its GAA technology, a key technology enabler for AI.

Entering its third year of mass production, Samsung's GAA process continues to demonstrate continued maturity in terms of yield and performance. With its accumulated GAA production experience, Samsung plans to mass-produce its second-generation 3nm process (SF3) in the second half of this year and achieve GAA on the upcoming 2nm process.

Samsung said that its GAA production has been growing steadily since 2022 and is expected to expand significantly in the coming years.

Highlight Samsung's cross-company collaboration for AI turnkey solutions

Another highlight was the launch of Samsung's AI Solution, a turnkey AI platform that is the result of a joint effort of the company's foundry, memory, and AVP business units.

By combining the unique strengths of each business, Samsung provides high-performance, low-power, and high-bandwidth solutions that can be customized to specific customer AI needs.

Cross-company collaboration also streamlined supply chain management (SCM) and reduced time to market, resulting in a significant 20% increase in total turnaround time (TAT).

Samsung plans to launch an all-in-one, CPO-integrated AI solution in 2027, aiming to provide customers with one-stop AI solutions.

Diversify your customers and applications, and achieve a balanced portfolio from AI to mainstream technologies

Samsung has also made significant progress in diversifying its customer base and application areas.

Over the past year, close collaboration with customers has led to an 80% increase in AI sales at Samsung Foundry, reflecting its commitment to meeting the changing needs of the market.

In addition to cutting-edge process nodes, Samsung also offers specialty and 8-inch wafer derivatives that continuously improve PPA and are cost-competitive. With this balanced technology portfolio, the company meets the needs of customers in automotive, medical, wearables and IoT applications.

Integrate artificial intelligence and technology to promote the common growth of the foundry ecosystem

Building on the momentum of the SFF event, Samsung will also host its annual Samsung Advanced Foundry Ecosystem (SAFE™) Forum on June 13. The forum, titled "AI: Exploring Possibilities and Futures," will serve as a collaborative platform for ecosystem partners to discuss technologies and solutions tailored to AI.

At this year's forum, industry leaders such as Mike Ellow, CEO of Siemens, Bill En, Vice President of AMD, and David Lazovsky, CEO of Celestial AI, will share their insights on the future of silicon and system design technology.

Following the establishment of the MDI Alliance last year, the forum will also host the first MDI Alliance Workshop. Samsung will hold extensive discussions with alliance partners on co-development opportunities and specific cooperation plans, with a focus on 2.5D and 3D IC design, to develop comprehensive solutions. These activities will further strengthen the partnership and promote a shared vision. (Xinzhixun)