Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
Message: SHINE video/Aaron Thean interviewed by Marvell
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Companies can achieve a higher return on investment through packaging and chip wiring than transistor innovation, notes Aaron Thean, deputy president and provost of the National University of Singapore and director of Singapore Hybrid-Integrated Next-Generation µ-Electronics Centre (SHINE), a Singaporean organization working advancing chiplets. It’s a stark change in how the semi business operates. Hear more in the interview from Driving Semiconductor Innovation for AI co-sponsored by NUS and Marvell.