Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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https://www.cioe.cn/en/Exhibitor.html

 

This certainly looks like the place to be to make a splash. Hopefully by then they have announced their North American Tier 1 partner to alleviate that pain point. 

September is too long, but we are accustomed to waiting. 

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