Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Date of patent : July 16th, 2024

Patent number : US-12038610-B2

Inventor :  Yee Loy Lam, Singapore (SG)

Title : Wafer-level optoelectronic packaging

https://ppubs.uspto.gov/dirsearch-public/print/downloadPdf/12038610

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