Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Tuesday

8) On May 14, 2024, the Company announced that Foxconn Interconnect Technology (“FIT”), a market leader of interconnect solutions for communication infrastructure and several other large, high-growth markets, has selected POET’s optical engines, which are silicon photonics integrated circuits (Silicon PIC), for its 800G and 1.6T optical transceiver modules.

FJ: "Jamie have you heard anything about the new high speed module they will be demonstrating/showing off?"

Jamie: 3.2T?

Jamie I am not sure what to expect beyond 800G but they demonstrated 200G/lane at OFC and that is what is required for 3.2T?

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