CIOE 2024 Invitation|Niobao Optoelectronics Meets You in Shenzhen(12C53)

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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CIOE 2024 Invitation|Niobao Optoelectronics Meets You in Shenzhen(12C53)

posted on Sep 03, 2024 10:50AM

CIOE 2024 Invitation|Niobium Optoelectronics will meet you in Shenzhen(12C53) - Xunshiguang Communication Network (iccsz.com)

Abstract: Niobium Optoelectronics will showcase the latest thin-film lithium niobate (TFLN) chips and devices at CIOE 2024, booth number: #12C53

Niobium Optoelectronics will participate in the 2024 CIOE (September 11-13, Shenzhen World Exhibition & Convention Center), during which it will display the latest thin-film lithium niobate (TFLN) chips and devices, including: 1.6T DR8/800G DR4 chip, 128GBaud PDMIQ chip, ultra-high bandwidth (>110GHz) chip, 20/40G IQ modulator, 20G/40G/67G intensity modulator (can integrate light source), etc., booth number: #12C53, sincerely welcome all colleagues in the industry to visit and exchange.

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