Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Energy Efficient Interfaces (EEI) and Co-Packaging. AAOI

posted on Sep 24, 2024 01:01PM

Poet inside?

AAOI - AOI Leads Industry with 1.6T OSFP DR8 LPO Technology at ECOC 2024

EEI and co-packaging architecture static conceptual demonstration:

New designs will be previewed for integrating Energy Efficient Interfaces (EEI) and Co-Packaging.

https://marketwirenews.com/news-releases/aoi-leads-industry-with-1-6t-osfp-dr8-lpo-technology-6564908443608736.html

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