Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Date of patent : September 24th, 2024

Patent number : US-12099236-B2

Inventor :  Suresh Vendatesan, Los Gatos CA (US); Yee Loy Lam, Singapore (SG)

Title : Optical dielectric waveguide subassembly structures

https://ppubs.uspto.gov/dirsearch-public/print/downloadBasicPdf/12099236?requestToken=eyJzdWIiOiI2YjUzZDAyZC02ZTU2LTQ2ODctYjE0MC1mZmM4ODNkNDhjYjUiLCJ2ZXIiOiIzMjZkZDIzZi1jMmYzLTRhYWItYWUwYS00ODdlYWM2ODAxNGIiLCJleHAiOjB9

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Paulyboy
Sep 28, 2024 09:26PM
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