Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Date of patent : October 1st, 2024

Patent number : US-12105141-B2

Inventors :  Locas Soldano, San Jose CA (US);  Jing Yang, Singapore (SG); Yong Meng Lee, San Jose CA (US); Suresh Vendatesan, San Jose CA (US);

Title : Structure and method for testing of PIC with an upturned mirror

Link : https://ppubs.uspto.gov/dirsearch-public/print/downloadBasicPdf/12105141?requestToken=eyJzdWIiOiI1YmZmYjgxMi1jZTczLTQwNzktYWEwNC0yN2M5ODJkNzZjZDYiLCJ2ZXIiOiIxZGVhYzc2ZS02NDI1LTQyMGEtYWQ4Zi04OWM0NGMzZmU2NjkiLCJleHAiOjB9

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