Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Dave L EETimes Youtube

Newage: 

1. CAI plans to introduce Gen 1 chiplet in 2024

- This means Gen 1 factory has to be finished in the next 2-3 month
- Before an introduction of Gen 1, the factory has to be established, which takes months IMO.
  Therefore I suppose this started months ago.

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Having experienced forward looking statements made by POET, "planning to introduce something" is sounding like a proof of concept demonstration. 

POET is ready. TSMC will be ready for chiplet fabrication when CAI,Samsung and AMD are ready. As for the status of the factory that will  be producing the PF-Memory Appliance units, they are very likely to be ready with the boxes that will house the output from TSMC. The factory and CAI investor: https://www.penguinsolutions.com/

   

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