Thanks for being a catalyst.
Even the EML business today it's all wirebonds
The eye-catcher is ”it's all wirebonds”.
Passive alignment of the photonic elements and use of high-speed RF traces between the electronic and photonic components to avoid wire-bonds are two hallmarks of the technology. From:
https://www.globenewswire.com/fr/news-release/2024/05/14/2881223/0/en/POET-Announces-Design-Win-and-Collaboration-with-Foxconn-Interconnect-Technology-for-High-speed-AI-Systems.html