"Moreover, FIT is leading the way in technological advancements by collaborating with partners to develop the CPO (Co-Packaged Optics) high-speed interconnect solutions. These solutions, which utilize advanced silicon photonics technology, significantly improve data transmission efficiency and reduce signal attenuation, providing robust support for AI applications. In terms of innovation, FIT’s conceptual FITConn 800G high-speed connector module, a Red Dot Design Award winner, made its physical debut, showcasing a groundbreaking design that eliminates data loss during transmission and dramatically enhances connectivity performance."

Hmm!  I wonder if they're talking about Poet here?