I ignore complex diagrams and find a takeaway such as "Mitsubishi moved quickly to be ready now".
From one of the PDFs:
Nov. 2021: Started operations
Apr. 2022: Started mass production of 8-inch Si wafers
Aug. 2023: Completed installation of 12-inch wafer processing line
Sept. 2024: Started supplying power semiconductor chips made from 12-inch Si wafers for semiconductor module assembly