I assume that a 12" wafer for power semiconductor chips can accommodate chips for Optical Interposers. AmIRight?

Right now we have 8" wafers coming from Silterra, staffed by POET personnel for IP protection, the finished wafers are sent to SPX for dicing and customizing and then sold as OIs and OEs in modules under the license agreements.

Mitsubishi could replace or augment Silterra using 12" tech, which lowers the costs a lot by making more chips in one go. A 12" wafer has 2.25 times the area of an 8" wafer, a significant step toward making these chips affordable and ubuiquitous.