Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
Message: Pluggables over CPO for Hyperscalers – Mark Lutkowitz
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Re: Pluggables over CPO for Hyperscalers – Mark Lutkowitz
That was helpful to hear. Are copper traces so hard to give up? Even if they are, I believe the quantity that will be used in the hyper-scales will be such that they have to go with co-packages just to reduce heat. Make sense to you, or no?