Agoracom: Small Cap Investment - POET Technologies Inc. - Panel Discussion: Scaling Interconnect and Memory for AI Clusters

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Panel Discussion: Scaling Interconnect and Memory for AI Clusters

posted on Oct 16, 2024 12:06PM

Nigel Alvares (Marvell), Chris Petersen (Astera Labs), TaekSang Song (Samsung), James Kelly (OCP) The AI revolution is transforming the data center and server memory landscape, driving a demand for high-capacity and high-bandwidth solutions. This panel session explores innovative approaches to overcoming conventional memory architecture limitations. Join industry leaders from Samsung, Marvell, and Astera Labs as we take a look at cutting-edge solutions under consideration in the OCP Community Projects and AI strategic initiative. Well cover Samsung, Marvell and Astera Labs advanced memory line-ups with Compute Express Link (CXL), the impact on server and data center economics, a vision for a robust AI connectivity backbone, paving the way for scalable, efficient, and sustainable AI infrastructure.