Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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109 pages

Date of application : June 25th, 2024  (published October 17th, 2024)

Patent number : US-20240345340-A1

Inventor :  Suresh Vendatesan, Los Gatos CA (US)

Title : SELF-ALIGNED STRUCTURE AND METHOD ON INTERPOSER-BASED PIC

Link : https://ppubs.uspto.gov/dirsearch-public/print/downloadBasicPdf/20240345340?requestToken=eyJzdWIiOiI2ZDlmY2Q2Yi00YTJjLTRiZTgtYTYyYy1lZjlmNTQ0OTg1MDciLCJ2ZXIiOiIxMTBjYTAxMi0xOTk3LTQxYTUtYjUwZS0xYzAwMzFiZWI5MzMiLCJleHAiOjB9

 

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