B&C that was a very good description of why chiplet platforms are the direction that the semiconductor industry has turned to. What POET has done with the Optical Interposer is to extend the flexibility offered by electrical interposer to produce a highly efficient platform to add photonics into the mix. POET can use the most advanced chips in the electrical domain produced by industry today. The absolute best nodes that have become available through years of evolution characterized by Moore's Law.

Industry is now highly motivated to generate those kinds of improvements in photonics to harness those efficiencies that have been made available by 3d packaging. The Optical interposer extends the package and makes it available to integrate the most advanced designs available in optical communications. The motivation needed to generate advancements in the photonics domain is very clear and will continue to be developed in multiple generations. POETs Optical Interposer offers a pathway that allows for that development to be ramped very quickly when compared to how Moore's Law has slowed to an inevitable conclusion. Photonics developments continue to advance and accelerate. The POET Optical Interposer is in the right place at the right time. There is so much more on the horizon for POET. The integration of the world's first 400G EML is indicative of what to expect next in POETs path to integrate the most advanced and low cost devices to push this packaging technology well into the future. 

Also I would add that the biggest customers in the world call the shots on what they want and POET's packaging technology can make those demands happen very quickly. These customers have log established relationships with their suppliers and POET has the ability to quickly integrate their preferred devices into the package.

High performance flexibility is what industry is seeing when they take a close look at the POET Optical Interposer and I think the market is starting to recognize this.