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Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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MIT Team Uses 2D Materials To Add Optical Comms On-chip

wake

Oct 25, 2017 12:30PM

Rainer

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Re: MIT Team Uses 2D Materials To Add Optical Comms On-chip

in response to

MIT Team Uses 2D Materials To Add Optical Comms On-chip

wake

posted on Oct 26, 2017 12:07AM

Ah, that sounds like a possible upcoming competitor to the GaAs platform. Still in an early stage, though.

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Re: MIT Team Uses 2D Materials To Add Optical Comms On-chip

wake

Oct 26, 2017 12:05PM

Re: MIT Team Uses 2D Materials To Add Optical Comms On-chip

CAinPlap

Oct 26, 2017 04:50PM

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