Laser Focus World announces 2019 Innovators Awards

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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wake

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Laser Focus World announces 2019 Innovators Awards

posted on Nov 20, 2019 12:48PM

Nice to see our partners at Palomar Technologies winning a silver in the 2019 Innovators awards for the following:

PHOTONIC COMPONENT MANUFACTURING EQUIPMENT | 6532HP Die Bonder

Designed for assembling photonics packaging, especially VCSEL and photodiode packaging, the 6532HP die bonder combines both high volume and high precision into a unique dual-head solution with parallel processing and 1.5 µm accuracy to automate die presentation for increased bonding throughput. A large and flexible work area enables a range of presentation options from die ejectors for 4–8 in. wafers, 2 in. and 4 in. waffle packs, tape feeders, and custom stages. Bonding options range from pulse heat, steady state eutectic attach, in situ UV cure, and epoxy daubing and dispense. Reliable and accurate part localization maximizes throughput. Palomar Technologies (Carlsbad, CA; www.bonders.com)

Full article here:

https://www.laserfocusworld.com/home/article/14068944/laser-focus-world-announces-2019-innovators-awards

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